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Updated on July 26 (Registration and Accommodation)
> Aim and Themes
Micro/meso-scale (between macro and micro) manufacturing has been developed
in research fields of machining, forming, materials and others, but application
to industrial products is not sufficient. The main objective of this forum
is to bring together the possibility from academic research and the needs
of industries as much as possible. This forum consists of paper sessions,
group discussions, a panel discussion and a symposium for matching state-of-the-art
technologies and needs. The exhibition of the achievement of industrial
products is also planned to encourage the participants to touch concrete
shape and function. In addition to seek for practical use, pure scientific
approach is welcome in the paper sessions for understanding of various
technological fields.
Topics covered
are:
> Microfactory Concepts and Micro-manufacturing Applications
> Micromachining
> Micro forming
> Micro-EDM and others
> Materials for Micro manufacturing
> Tribology and Surface Engineering in Micro manufacturing
> Important Dates
Submission deadline
of abstract February 28, 2010
Abstract deadline is extended to March 24, 2010
Notification
of abstract acceptance March
31, 2010
Submission deadline
of full paper June
30, 2010
Notification
of final paper acceptance August 15,
2010
Final Early Bird
Registration August
31, 2010
Public Final
Registration September
15, 2010
> Call for papers
Abstract
Template is available from here.
Please send the
abstract PDF file to contact@ifmm10.org
with the title of "IFMM10 Abstract".
Full paper
Please prepare
up-to 6 pages full paper in A4 size
as a PDF file. Template is available from here.
Please send the full-paper file to contact@ifmm10.org
with the title of "IFMM10 Full Paper".
> About publications
Since the copyrights
for the papers remain with the authors, the authors
are free to also consider submitting their paper
either in its original or in extended form to a
journal for publication. Possible journals include
but are not limited to:
(1) Transactions
of ASME: Journal of Manufacturing Science and Engineering
(journaltool.asme.org)
(2) SME: Journal
of Manufacturing Processes (http://www.elsevier.com/wps/find/journaldescription.cws_home/620379/description)
etc.
> Conference Fees
Category Before
or On August 31 After September 1
Participants
JPY60,000 JPY70,000
Students JPY30,000 JPY40,000
Accompanying
Person JPY20,000 JPY30,000
Participants
(Day 3 only) JPY20,000 JPY30,000
> Registration
Online registration is available from here.
New window will open.
> Accommodation
Hotel reservation is available from here.
New window will open.
1) Choose -Make a Reservation- from red-colored "WEB Reservation".
2) Click on the "Campaign Package" at left-hand side of the new page.
3) Enter account name and password (informed by e-mail) and click on the login.
4) You can choose arrival date, length of stay, etc. and search available rooms.
5) From the list of available rooms, you can make a reservation.
> International Scientific Committee
Jian
Cao, Northwestern University, USA
Stefan
Dimov, Cardiff University, UK
Kornel
Ehmann, Northwestern University, USA
Ulf
Engel, University of Erlangen-Nuremberg, Germany
Ho-Chung
Fu, MIRDC,Taiwan
Y.S.Liao,
National Taiwan University, Taiwan
Jian
Lu, Hong Kong Polytechnic University, China
Jong-Kweon
Park, KIMM, Korea
Mustafizur
Rahman, National University of Singapore, Singapore
Reijo
Tuokko, Tampere University of Technology, Finland
> International Organizing Committee
Kuniaki Dohda, Nagoya Institute of Technology, Japan (General Chair)
Yuichi Okazaki, AIST, Japan (Co-Chair)
Tojiro Aoyama, Keio University, Japan
Mogens Arentoft, Technical University of Denmark, Denmark
Pieter Jan Bolt, TNO Science & Industry, The Netherland
Suman Chakraborty, Indian Institute of Technology, Kharagpur, India
Dong-Woo Cho, Pohang University of Science & Technology, Korea
Martin L.Culpepper, Massachusetts Institute of Technology, USA
Atsushi Danno, Singapore IMT, Singapore
Xianghuai Dong, Shanghai Jiao Tong University, China
Ruxu Du, The Chinese University of Hong Kong, China
Naga Hanumaiah, CMERI, USA
Kenji Hirota, Kyushu Institute of Technology, Japan
Kun-Min Huang, Metal Industries R & D Centre, Taiwan
You-Min Huang, National Taiwan University of Science & Technology
Liu Lin, Huazhong University of Science and Technology, China
Pham Van Hung, Hanoi University of Technology, Viet Nam
Lee, Sang Jo, Yonsei University, Korea
Suhas S. Joshi, Indian Institute of Technology, Bombay, India
Shiv G. Kapoor, University of Illinois at Urbana-Champaign, USA
Matthias Kautt, Karlsruhe Institute of Technology, Germany
Brad Lee Kinsey, University of New Hampshire, USA
Kazuhiko Kitamura, Nagoya Institute of Technology, Japan
Muammer Koc, Virginia Commonwealth University, USA
Isao Kuboki, Kogakuin University, Japan
Thomas R. Kurfess, Clemson University, USA
Tsunemoto Kuriyagawa, Tohoku University, Japan
Daewoo Lee, Pusan National University, Korea
Steven Y. Liang, Georgia Institute of Technology, USA
Marc J. Madou, University of California, USA
Yasuo Marumo, Kumamoto University, Japan
Shinsuke Matsui, NTT Photonics Laboratories, Japan
Takashi Matsumura, Tokyo Denki University, Japan
Chiristopher Matthew, Cardiff University, UK
J. Rhett Mayor, Georgia Institute of Technology, USA
Toshihiko Mori, Nagoya University, Japan
Noboru Morita, University of Toyama, Japan
Gracious Ngaile, North Carolina State University, USA
Jun Ni, University of Michigan College of Engineering, USA
Hitoshi Ohmori, RIKEN, Japan
Frank E.Pfefferkorn, University of Wisconsin, USA
Kamlakar Rajurkar, University of Nebraska, USA
N.Venkata Reddy, Indian Institute of Technology, Kanpur, India
Ro, Seung-Kook, Korea Institute of Machinery&Materials, Korea
Yasunori Saotome, Tohoku University, Japan
Shih-Ming Wang, Chung Yuan Christian University, Taiwan
Ming Yang, Tokyo Metropolitan University, Japan
Kai-Feng Zhang, Harbin Institute of Technology, China
> IFMM'10 Secretariat
Norio
Takatsuji, University of Toyama
Takehiko
Makino, Nagoya Institute of Technology
E-mail: contact@ifmm10.org
> Provisional Program
Early Day Program - Wednesday
20 October, 2010
> Registration (start from 18:00)
Day 1 - Thursday
21 October, 2010
> Registration
> Opening Ceremony
> Paper Session
> Welcome Reception
Day 2 - Friday
22 October, 2010
> Paper Session
> Panel Session
> Banquet
Day 3 - Saturday
23 October, 2010
> Symposium on Micro Manufacturing (Plenary Lectures)
> Closing Ceremony
Late Day Program - Sunday
24 October, 2010
> Industry Tour (If there are some, the plan will be made)
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